The first 300-millimeter power silicon carbide (SiC) wafer
sshah03
125 points
66 comments
November 09, 2026
Related Discussions
Found 5 related stories in 118.3ms across 12,324 title embeddings via pgvector HNSW
- Extreme 220GHz+Broadband Silicon Capacitor X2SC 0201M 22nF BV11 peter_d_sherman · 15 pts · August 10, 2026 · 47% similar
- How to Build a $20B Semiconductor Fab (2024) Bluestein · 17 pts · September 11, 2026 · 45% similar
- Air holes turn silicon wafers into flat UV focusing mirrors for compact optics bookofjoe · 11 pts · November 07, 2026 · 44% similar
- Hot Chips 2026: Samsung and HBM Base Die Opportunities rbanffy · 22 pts · August 24, 2026 · 41% similar
- Hot Chips 2026: Applying High Bandwidth Flash (HBF) ksec · 50 pts · August 24, 2026 · 40% similar
Discussion Highlights (7 comments)
bradknowles
The summary at the top of that page is: Infineon marks innovation milestone with world’s first 300-millimeter power silicon carbide (SiC) wafer PBusiness & Financial Press Nov 09, 2026 Infineon presents industry-first functional power devices processed on 300-millimeter silicon carbide wafers Technological breakthrough underlines Infineon’s innovation strength and leadership in power semiconductors and wide-bandgap technologies 300-millimeter SiC process feasibility lays the foundation for secure, future-proof SiC supply to customers in automotive, renewable energy, industrial and AI data center applications Infineon will present the first processed 300-millimeter SiC wafer to the public at the electronica trade show starting 10 November 2026 in Munich
novaRom
Can you guys restart DRAM production in Europe again? If 20 or so years ago it was possible, today is the best economical opportunity.
alephnerd
This may not appear sexy but this is a huge deal. Power semiconductors are critical for most NatSec and industrial usecases. You can likely live without a new gaming rig. You likely cannot live without replaceable parts for trucks and cars.
LoganDark
How does this compare to GaN? Better or worse?
mercurywells
I thought Wolfspeed was already at 300mm at the start of this year?
johntb86
Anyone know why it took so long for them to transition to 300mm? As mentioned in the article, they're mainly using existing 300mm equipment designed for silicon, which transitioned years ago. I imagine some process steps are different (mainly growing to larger boule, but probably others), but it doesn't seem like they would be huge blockers.
BrandiATMuhkuh
What surprises me with Infineon is that they seem to not work on a LLM on a chip. In particular that here in Linz Infineon, Apple's 5G modem designer and the Johannes Kepler University with Sepp Hochreiter (Inventor of LSTM) are just next to each other. I watched a interview of Infineon head of AI just recently, and I was like excited to hear about some cool hardware. And all he did is talk about how he uses LLMs.